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Philips lighting: deep plowing China, optimistic about China's stage lighting market prospects
"Light can change the world." With the development of LED light source and the gradual improvement of market acceptance, lighting light source can be applied in more and more fields, from indoor to outdoor, from special to general, application technology is becoming more and more mature; at the same time, the application of light source is more and more refined, and the variety of light source products designed for specific market segments is also increasing, and the demand is also increasing. Special lighting has become a new growth engine for LED enterprises.
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2018
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Zhaochi Energy Saving: Build LED Value Industry Chain, Upgrade Packaging "Intelligent Manufacturing"
With the continuous development and maturity of packaging technology, the market competition has entered the daytime stage, and the major LED packaging factories have adjusted their strategies to obtain the commanding heights. "Big Hengda, strong Hengqiang, survival of the fittest" in the LED packaging industry to show incisively and vividly. The intensification of competition makes large packaging companies constantly think about their own positioning. In addition to consolidating their competitive position in the packaging market, they also actively extend the industrial chain, accelerate resource integration, and strive to achieve the optimization of the upstream and downstream industrial chain.
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Strong supplier management
We who are engaged in supply chain management look very beautiful on the outside. After all, you are the job of sending money to suppliers and represent the supreme customer status. However, only we know how challenging our work is. As SQE, who hasn't blushed with their internal production, who hasn't yelled at their suppliers, and who has been gentle and gentle in doing business with your third-rate suppliers all day long?
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The most comprehensive summary of SMT welding quality problems in history
1.1.1. Wire drawing/tailing is a common defect in dispensing. The common causes include too small inner diameter of the adhesive nozzle, too high dispensing pressure, too large spacing between the adhesive nozzle and PCB, expired or poor quality of the adhesive patch, too good viscosity of the adhesive patch, failure to return to room temperature after being taken out of the refrigerator, too large dispensing amount, etc. 1.1.2. Solution: Replace the glue nozzle with larger inner diameter; Reduce the dispensing pressure; Adjust the height of "stop"; Change glue and select glue with appropriate viscosity. After the patch glue is taken out of the refrigerator, it should be returned to room temperature (about 4h) before putting into production. Adjust the dispensing amount.
Waste into treasure! British scholars proposed LED lighting vertical farm built here
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